NC650-250G > NC650 250 Gram Jar

NC650 250 Gram Jar

The NC650 is not longer available. It has been replaced by the NC670
The NC650 no-clean solder paste (Sn63 Pb37) is a modified rosin based paste, which allows a previously unseen level of repeatability and consistency. This paste offers an excellent open time, extended abandon time and good soldering activity with pin probable post soldering residues.
Data Sheet In stock and ready for shipment
QTY
$30.00
The NC650 is not longer available. It has been replaced by the NC670

Product Description
The NC650 no-clean solder paste (Sn63 Pb37) is a modified rosin based paste, which allows a previously unseen level of repeatability and consistency. This paste offers an excellent open time, extended abandon time and good soldering activity with pin probable post soldering residues.

Attributes
  • Pin- Probable Residue
  • ROL0 to ANSI/J-STD-004
  • Enhanced activity for tough to solder boards and components
  • Excellent slump resistance
  • High speed stencil printing up to 100mm/sec
  • Excellent tack performance and printer open time
  • Extended “between-print” abandon time


  • Performance
    The performance of solder paste depends in part on the metal content, solder alloy and the solder particle size range. Increasing metal content reduces the tendency to slump and reduces the tack life of the paste, while the solder balling performance improves.

    Refrigeration and storage: It is recommended to store NC650 at 5-10°C. The paste should be removed from cold storage a minimum of 8 hours in the unopened container prior to use. If the paste does not reach room temperature, it may stick to the stencil, not deposit onto the SMT pads, de-wet pads during reflow, outgas during reflow, or produce solder balls. Avoid direct sunlight.

    Handling and shelf life: The optimum temperature and humidity are 75°F and 60% or below respectively. Provided NC650 is stored tightly sealed in the original container at 5-10°C, a minimum shelf life of 6 months can be expected. Air shipment is recommended to minimize the time that containers are exposed to higher temperatures.

    Printing
    The NC650 solder paste is currently available for stencil printing down to 16 mil (0.4mm) pitch devices with type 3 powder (-325+500 mesh). Printing at up to 100 mm/sec. can be reliably achieved in production using a metal squeegee blade. This is due to a unique rheology, which ensures that the higher shear rate viscosity is relatively low and the thixotropic index is high enough to ensure excellent definition and slump resistance, while maintaining good roll and drop off behavior. High squeegee pressures are not required, making NC650 particularly useful for second side printing processes.

    Reflow
    Reflow should be performed at 35-40°C above the liquid temperature of the alloy (depending on the type of board). This temperature should be maintained for 30-45 seconds. Profiles should have less than a 3-minute preheat time above 260°F(130°C) to insure proper wetting of fine pitch leads.

    Cleaning
    If cleaning is required, use a semi-aqueous solvent or DI water with a saponifier such as Florida Cirtech RA2000 (saponifier concentration 4-6% @ 120-150°F).

    Health & Safety
    This product, during handling or use, may be hazardous to health or the environment. Read the Material Safety Data Sheet and warning label before using this product.

    Packaging
    The NC650 solder paste is also available in: 500gram gram plastic jar. 1 Kilogram, 500 gram or 250 gram cartridge for direct application. DEK ProFlow cassettes available upon request.
    Printing Parameters Value
    Viscosity (measured at 25C using Brookfield Viscometer 670,000) 670,000cps
    Print Speed 20-100 mm/sec.
    Squeegee Blade 80 to 90 durometer or stainless steel
    Stencil Material Stainless Steel,Molybdenum, Brass,Nickle Plated
    Temperature/Humidity Optimal ranges are 70-77F and 35-65%RH

    Performance Parameters Value
    Stencil Life (20C @ 45% RH) +24 Hours
    Tack Life +48 Hours
    Tack Force 1.6 grams/mm2
    Slump  
    Room Temp., 1 hour  
    0.7mm pads 0.2mm
    1.5mm pads 0.2mm
    80°C, 20 minutes  
    Note: Slump is expressed as the minimum spacing between pads that does not allow bridging.
    Abandon Time  
    Pitch  
    20 mil and greater >4 hours
    16 mil and less (10 mil aperture) 2 hour
    (8 mil or less aperture) 1 hour
    Flux Activity (per ANSI/J-STD-006) ROL0
    Copper Mirror (per IPC-J-STD-004) Pass
    Copper Plate Corrosion (per ANSI/JSTD-004) Pass
    Typical SIR, IPC @ 96 hours (per IPC-J-STD-004) Pass (>2.0 X 10-9 ohms)
    Typical SIR, IPC @ 168 hours (per IPC-J-STD-004) Pass (>1.5 X 10-9 ohms)