Process Capability
|
|---|
| Spec 1 | Spec 2 | unit | Standard | Special |
|---|
| Image transfer |
Min trace width/space in inner layer |
1/2oz base |
mil |
4/4 |
|
|---|
| 1oz base |
mil |
5/5 |
| 2oz base |
mil |
8/8.5 |
| 3oz base |
mil |
12/10.5 |
| 4oz base |
mil |
18/14 |
| Min trace width/space in outer layer |
1/2oz base |
mil |
4/4.7 |
| 1oz base |
mil |
5/5.2 |
| 2oz base |
mil |
9/9.5 |
| 3oz base |
mil |
12/14 |
| 4oz base |
mil |
18/21 |
| Compensation to inner layer (Hoz/1oz/2oz/3oz/4oz) |
mil |
0.5/1.0/2.5/3.5/6.0 |
| Compensation to outer layer (Hoz/1oz/2oz/3oz/4oz) |
mil |
1.2/1.7/4.5/6.0/9.0 |
| Inner layer isolation ring width(single side) (Min) |
mil |
10(≤6 layer);12(7-14 layer);14(layer≥14) |
| Through hole min pad ring size (inner) |
mil |
5(1/2oz,1oz),6(2oz),8(3oz) |
| Through hole min pad ring size (outer) |
mil |
4 (before compensation) |
| Min inner layer isolation strip width(after compensation) |
mil |
8 |
7 |
| Min space from conductor to board edge in inner layer |
mil |
8 |
7 |
| Min space from conductor to board edge in outer layer |
mil |
8 |
6 |
| Min grid trace width/space finished size |
mil |
6/6(1/2oz Base); 6/6(1oz Base); 10/8(2oz Base)
10/10(3oz Base); 12/12(4oz Base)
|
|
| Min Via pad size(single side) |
|
4 |
3 |
| Etching logo line width(Min) |
mil |
8(1/2oz Base); 10(1oz Base); 12(2oz Base) |
|
| Laminating |
Min dielectric thickness |
mm |
18um Base) |
|---|
| Max dielectric thickness(no bare core) |
mm |
7628+2116+7628=0.185+0. 105+0.185=0.475 |
| Board thickness tol. (T≤1.0mm) |
mm |
±0.1 |
| Board thickness tol.(T>1.0mm) |
% |
±10(1.0mm<T≤2.4mm),±8(T>2.4mm) |
| Twist |
% |
0.7 (NO SMT board);0.5(SMT board) |
0.2 |
| Drilling |
Drilling size |
mm |
0.2-6.3(step:0.05mm) |
0.15 |
|---|
| Min drilling size for High frequency board |
mm |
0.25 |
0.20 |
| Min NPTH in first drilling step |
mm |
0.5 |
0.2 |
| Hole wall to conductor space(Min) |
mil |
8(≤6layer );10(≤14layer) |
|
| Min hole to conductor space for blind/buried board |
mil |
9(1 time laminating);10(2 or 3times laminating) |
| Min. space from two hole wall in the same network |
mil |
6(after compensation) |
| Min space from two hole wall in the diff. network |
mil |
12(after compensation) |
| Space from two NPTH wall(Min) |
mil |
8 |
| Hole position tol. |
mil |
±3 |
| Press fit hole tol. |
mil |
±6 |
| Drilling diameter tol. |
mm |
0.04 |
| Drilling slot tol. |
mm |
±0.15(long side)±0.10(short side) |
| Mill cutter diameter |
mm |
0.60--1.20 |
| Slot length direction/width direction |
|
1.8?1 |
| Depth tol. of step hole and countersink |
mm |
±0.2 |
±0.10 |
| Tol. of Step hole and countersink |
mm |
±0.15 |
±0.10 |
| Hole angle tol. of step hole and counter sink |
° |
±10 |
|
| PTH |
Min. copper thickness in hole |
um |
20 |
|---|
| Solder mask(S/M) |
S/M type |
|
Nanya LP-4G |
|---|
| S/M color |
green, yellow, black, white, red, blue |
| S/M opening single side(Min) |
mil |
2 |
| Min S/M opening width for logo |
mil |
8 |
| Min S/M opening single side for NPTH |
mil |
4 |
| S/M bridge(Min) |
mil |
4(green),5(other color) |
| S/M hardness |
H |
6 |
| S/M thickness(corner of the trace)(Min) |
um |
10 |
| S/M thickness over via |
um |
8-10 |
15 |
| S/M over max copper |
oz |
4 |
|
| Plugged via(Max) |
mm |
≤0.35 |
0.4-0.8 |
| Silkscreen |
Silkscreen color |
|
white, black, yellow, grey |
|
|---|
| Silkscreen line Width/Height(18um Base) |
mil |
4/27 |
| Silkscreen line Width/Height(35um Base) |
mil |
5/30 |
| Silkscreen line Width/Height(70um Base) |
mil |
6/45 |
| Min space from silkscreen to pads |
mil |
6 |
4 |
| Min space between carbon ink pad |
mil |
15 |
12 |
| Min space between carbon ink and conductor |
mil |
10 |
8 |
| Carbon ink larger than conductor by min. size |
mil |
6 |
4 |
| Carbon ink sheet resistance |
ohm |
15 |
|
| Peellable mask |
|
SD-2955,SD-2954, HL-808B(QUNQIANG) |
| Silkscreen |
Peelable mask thickness |
mm |
0.20--0.50 |
|---|
| Peelable mask opening larger than conductor by min size |
mil |
7 |
6 |
| Min space from peelable mask to pad(min) |
mil |
16 |
14 |
| Max plugged via size for peelable mask |
mm |
5 |
|
| Gold finger |
Ni thickness standard |
um |
3-5 |
|---|
| Au thickness standard |
um |
0.8-1.3 |
| Max finger length(max) |
inch |
2 |
| Finger space(min) |
mil |
7 |
| Immersion gold |
Ni thickness standard |
um |
3-6 |
|---|
| Au thickness standard |
um |
0.05--0.075 |
0.05-0.1 |
| Immersion Sn |
Sn thickness |
mm |
0.80-1.20 |
|
|---|
| Min board size |
mm |
50*100 |
| Immersion Ag |
Ag thickness |
um |
0.10-0.30 |
|---|
| Min board size |
mm |
60*80 |
| OSP |
OSP thickness |
um |
0.15-0.30 |
|---|
| Min board size |
mm |
110*110 |
| HASL |
Min SMT/BGA pad space |
mil |
6 |
|---|
| Board thickness(finished) |
mm |
0.6-3.0 |
0.5-4.0 |
| Sn thickness |
um |
2?40 |
|
| Lead free HASL |
Sn thickness |
um |
2-40 |
|---|
| Routing |
Outline tol. |
mil |
±6 |
±4 |
|---|
| Milling cutter size(Min) |
mm |
0.8 |
|
| Radius at inner angle(Min) |
mm |
0.5 |
0.4 |
| Chamfer angle for gold finger |
° |
20---60 |
|
| Gold finger chamfer angle tol. |
° |
±5 |
| Gold finger chamfer depth tol. |
mm |
±0.20 |
| Slot size tol.(milling slot) |
mm |
±0.15 |
±0.12 |
| Second drilling step hole tol. |
mil |
≥3 |
|
| Second drilling step hole location tol. |
mil |
±5 |
| V-CUT angle |
° |
20,30,45,60 |
| V-CUT angle tol. |
° |
±5 |
| V-CUT symmetry tol. |
mm |
±0.05 |
| V-CUT web thickness tol. |
mm |
±0.1 |
| Min dis. from V-cut central line to conductor (T≤1.0) |
mm |
0.3(20°),0.33(30°),0.37(45°),0.42(60°) |
| Min dis. from V-cut central line to conductor (1.0<=T≤1.6) |
mm |
0.36(20°),0.4(30°),0.5(45°),0.6(60°) |
| Min dis. from V-cut central line to conductor (1.6<=T≤2.4) |
mm |
0.42(20°),0.51(30°),0.64(45°),0.8(60°) |
| Min dis. from V-cut central line to conductor (2.5<=T≤3.2) |
mm |
0.47(20°),0.59(30°):0.77(45°):0.97(60°) |
| Remain thickness tol. of Gold finger after chamfer |
mil |
±5 |
| Guide trace for gold finger |
mil |
20 |
10 |
| Bridge+stamp hole standard design |
|
3drill hole in one bridge, hole wall dis. 0.3mm,4 hole wall, hole size0.6-1.0mm,bridge dis.≤3inch |
|
| E-test |
Space form e-test point to board edge |
mm |
0.5 |
|---|
| Resistance for Short |
ohm |
10 |
7 |
| Resistance for Opens (min) |
ohm |
5 |
|
| Insulation resistance for Shorts (max) |
M ohm |
100 |
| Test voltage |
v |
200 |
500 |
| electric current (max) |
mA |
200 |
|
| FQC report and test |
COC report |
|
standard |
|---|
| Impedance control test |
standard |
| Micro-section test |
standard |
| Thermal shock test |
|
| Withstanding voltage test |
| Ionic contamination test |
| Solder ability test |
| Insulation resistance test |
| Peel-able strength test |
