NL932 No Clean Lead Free Solder Paste

NL932 No Clean Lead Free Solder Paste

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Quick Overview
The NL932, manufactured by FCT Solder, delivers Surface Area Ratio (SAR) paste transfer efficiencies below 0.6 and 0.55 respectively. NL932 is formulated to deliver exceptional cosmetics, especially when used in conjunction with Nihon Superior’s SN100C patented lead free alloy. It was specially designed to meet the requirements for reliable solder joints in printed circuit board assemblies.
  • Alloys SAC305 & SN100C
  • Stencil life > 8 hours
  • Extensive Tack Time
  • Halogen and Halide Free
  • Speed 25 to 150 mm/sec.
  • Clear Residue
Alloy (Leaded or Lead Free)
Your selection is: NL932 No Clean Lead Free Solder Paste
30 Gram Syringe
Alloy (Leaded or Lead Free)
Unit Price: $30.00


Product Description
The NL932 is a no-clean lead free solder paste designed to meet the requirements for reliable solder joints in Printed Circuit Board assemblies. NL932 displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65º-85ºF) and relative humidity (25-65% RH). NL932 offers enhanced printing and reflow process windows. Aditionally, NL932's capability of IPC Class III for voiding and ROL-0 IPC classification ensures long-term reliability.


  • Excellent print volume consistency with Surface (SAR) as low as 0.45
  • Excellent wetting characteristics on all surface finishes, including OSP, Ni/Au, Ni/Pd/Au, SN100C HAL
  • Clear residue
  • High speed smt stencil printing up to 150mm/sec
  • Excellent low-voiding performance that exceeds IPC Class III requirement
  • Enhanced tack performance and printer open time
  • Very shiny solder joints when used with SN100C
  • Compatible in either Nitrogen or Air reflow

Product Information

  • SN100C - MP = 227°C
  • SAC305 – MP = 218°C
  • Automatic / Manual Printing
  • Automatic / Manual Dispensing
Powder Size
  • Type-3 and Type-4 standard
  • Type-5 available upon request
  • 500 gram jars or cartridges standard
  • Enclosed print head systems
  • Other packaging upon request
Repair Flux
  • 10CC and 30CC syringes
  • Larger package sizes upon request

Stencil aperture design and stencil quality are major factors in achieving excellent print consistency with any lead free solder paste. Laser Cut stencils from Stencils Unlimited are recommended for optimal print performance, and can be custom designed to minimize and improve the yields of any process. Some general stencil aperture design guidelines follow:

  • Fine pitch components (<= 0.020”) 
    A 0.001” reduction (L & W) to minimize bridging and create proper gasketing between the stencil and SMT pad
  • Discrete components 
    A 0.002” reduction (L & W) for water washable and a 0.002” reduction (L & W), with “U-shaped” home-plates, for no clean to minimize mid-chip solder beads.

Printer Operation

Solder Paste Bead Size:
  • 2cm (~0.75”) on startup
  • Add when bead < 1.4 cm (~0.5”)
  • Metal, Slic™ blade preferred
  • 60 degrees from horizontal
  • 25 to 150 mm/sec. (1 to 6 in/sec)
  • Adjust printer for a pull or print demand process
  • 0.18-0.27 Kg/cm (squeegee length)
Underside Wipe:
  • Slic™ and Ultraslic™ stencils should exceed >10 prints/wipe
Stencil life / Environment:
  • >8 hours
  • 30-65% RH and 20º C – 25º C
Tack Life:
  • 24hrs @ 25°C / 45% RH
Tack Force:
  • 1.5 grams/mm2
Slump 0.7mm Pads:
  • 0.4 @ 25°C / 1Hour
  • 0.4 @ 80°C / 20 minutes
Slump 1.5mm Pads:
  • 0.4 @ 25°C / 1Hour
  • 0.4 @ 80°C / 20 minutes

Storage and Handling

  • Cartridges should be stored tip down.
  • No Clean Paste can be stored up to two weeks at room temperature.
  • To prolong the shelf life of NL932, refrigerate between 5°C~10°C, (41°F~50°F). At this range the shelf life will exceed 8 months.
  • NL932 should not be allowed to freeze.
  • When refrigerated, lead free solder paste must be allowed to warm up to room temperature.
  • Lead Free Paste must be >= 22°C, (~66°F) prior to applying to stencil for processing.
  • Working range of NL932 is between 22-32°C, (~66°F - 89.5°F).
  • First-In-First-Out (FIFO) inventory management practices should be used with all lead free solder pastes.

A linear ramp of 0.7°C to 2.0°C C/second is suggested to gradually remove the solvents and other volatile components in the lead free solder paste. This also helps in minimizing solder balls, beading and bridging from hot slump.
A linear ramp also helps minimize depletion of flux activity which can occur with excessive temperature, preheat times, and at very high reflow temperatures.
A profile with a soak between 200-210°C for less than 20 seconds can be used to reduce void formation on BGA and CSP devices. (Request FCTA’s profile guide to void reduction).
While a linear profile typically does not produce tombstoning, a short 10-20 second dwell prior to transitioning into the liquidus point of the solder, and minimizing the QR between soak and liquid temperatures will help minimize tombstoning if experienced.

A cooling rate of 3°C-4°C per second is recommended for most lead/free reflow applications. These parameters should be utilized to insure a fine grain solder structure and minimal IMC layer.

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