Laser Cut SMT Stencils

StencilQuik™ are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device.

• StencilQuik comes in a pack of 10 BGA rework stencils.
• Allows you to replace your own BGAs or CSPs without special training or large capital equipment expenditures
• Acts as an insulating barrier between solder balls as the solder paste masks adjacent apertures increasing placement reliability
• Simplifies BGA placement as you can "feel" the device settle into the apertures of the StencilQuik™

These solder paste stencils are designed for high volume screen printing on printed circuit boards.

• Foils are permanently mounted into aluminum frames
• Provide optimum solder paste volume control
• Large variety of standard frames for every printer

** Framed stencils have smooth aperture walls and can be used for 16 Mil pitch and below and for Micro BGA"s.

Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc.

• Great for QFN’s where the pads on the board are larger than the pads on the component.
• All Flip Up stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
• All Flip Up stencils are custom made to order per your specification.

Unlike our Prototype SMT Stencils, Stencil Foils do not have flaps. They are flat for easy storage.

• Designed to work well with our prototype stencil printer
• Eliminates tedious hand soldering of prototype circuit boards
• Reduce PCB prototype assembly time

** The stencil kit comes with a squeegee blade and board holders.
** Our process using a Toaster Reflow Oven will make your prototype PCB assembly job easier and save you time.
** We are backing that with a money-back guarantee program.

These frameless SMT stencils are specifically designed to manually print solder paste onto printed circuit boards.

• Eliminates tedious hand soldering of prototype circuit boards
• Reduce PCB prototype assembly time
• It has flaps to contain and control solder paste application

** The stencil kit comes with a squeegee blade and board holders.
** Our process using a Toaster Reflow Oven will make your prototype PCB assembly job easier and save you time.
** We are backing that with a money-back guarantee program.

CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components.

• A CPF stencil makes for simple alignment when pasting, and serves as an excellent tool for applying paste when boards are highly populated.
• All CPF stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner.
• All CPF stencils are custom made to order per your specification.

These laser cut stencils are designed to work with stencil tensioning systems also known as Reusable Stencil Frames like the Wizard Frame.

• Reduces storage space requirements
• Significantly less expense than framed stencils
• Smooth aperture walls and can be used for 16 Mil pitch and below and for Micro BGA"s

** Framelss SMT Stencils are recommended for prototype printed circuit board assembly or short runs.

These solder paste stencils are designed for high volume screen printing on printed circuit boards.

• Foils are permanently mounted into aluminum frames
• Provide optimum solder paste volume control
• Large variety of standard frames for every printer

** Framed stencils have smooth aperture walls and can be used for 16 Mil pitch and below and for Micro BGA"s.

Electroformed Framed Sencils are nickel-based, electroform foils permanently mounted in a stencil frame using a mesh border to tightly stretch the stencil foil taut in the frame. Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).