Solder Paste

The NC676 No Clean Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time and good soldering activity with all surface finishes. NC676 meets or exceeds the requirements for ANSI/J-STD -004, -005 as well as all Bellcore test criteria for solder pastes. Residues left behind are clear and maintain a virtually indefinite pin probability life.

The WS888 is a water washable lead-free paste designed to meet the requirements for reliable solder joints in Printed Circuit Board assemblies. WS888 displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65°-85°F) and relative humidity (25% - 65% RH). Residues can be cleaned using warm water.

The NL932 is a no-clean lead free paste designed to meet the requirements for reliable solder joints in Printed Circuit Board assemblies. NL932 displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65º-85ºF) and relative humidity (25-65% RH). NL932 offers enhanced printing and reflow process windows. Aditionally, NL932's capability of IPC Class III for voiding and ROL-0 IPC classification ensures long-term reliability.