AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
- Alloy Sn63/Pb37 MP=183°C
- Large Process Window
- Excellent Wetting
- Alloy SAC305 MP=217°C (Lead Free)
- Stencil Life > 8 Hours
- T4 in stock and ready to ship